On-chip diffraction grating prepared by crystallographic wet-etch

ABSTRACT

Methods of forming microelectronic structures are described. Embodiments of those methods may include forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings, and then performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.

BACKGROUND

A Diffraction gratings (DG) is an important optical devices widely usedin applications where dispersing wavelengths are required. In free spaceoptics, DG's are usually fabricated by either mechanically burnishingthe grooves onto a substrate, or by reactive ion beam etching theholographic pattern developed by two beam interference. In waveguideoptics, DG's have been fabricated by utilizing standardphotolithographic and etching techniques.

BRIEF DESCRIPTION OF THE DRAWINGS

While the specification concludes with claims particularly pointing outand distinctly claiming certain embodiments, the advantages of thevarious embodiments can be more readily ascertained from the followingdescription of the embodiments when read in conjunction with theaccompanying drawings in which:

FIGS. 1 a-1 c represent methods of forming structures according toembodiments.

FIGS. 2 a-2 e represent methods of forming structures according toembodiments.

FIG. 3 represents structures according to embodiments.

FIG. 4 represents structures according to embodiments.

FIG. 5 represents a system according to embodiments.

DETAILED DESCRIPTION

In the following detailed description, reference is made to theaccompanying drawings that show, by way of illustration, the specificembodiments which may be practiced. These embodiments are described insufficient detail to enable those skilled in the art to practice theembodiments. It is to be understood that the various embodiments,although different, are not necessarily mutually exclusive. For example,a particular feature, structure, or characteristic described herein, inconnection with one embodiment, may be implemented within otherembodiments without departing from their spirit and scope. In addition,it is to be understood that the location or arrangement of individualelements within each disclosed embodiment may be modified withoutdeparting from their spirit and scope. The following detaileddescription is, therefore, not to be taken in a limiting sense, and thescope of the embodiments is defined only by the appended claims,appropriately interpreted, along with the full range of equivalents towhich the claims are entitled. In the drawings, like numerals refer tothe same or similar functionality throughout the several views.

Methods and associated structures of forming and utilizingmicroelectronic structures, such as a diffraction grating structures,are described. Those methods and structures may include forming aphotomask on a (110) silicon wafer substrate, wherein the photomaskcomprises a periodic array of parallelogram openings, and thenperforming a timed wet etch on the (110) silicon wafer substrate to forma diffraction grating structure that is etched into the (110) siliconwafer substrate. Various embodiments described herein enable thefabrication of plane diffraction gratings comprising ultra high opticalqualities.

FIGS. 1 a-1 c illustrate embodiments of forming microelectronicstructures, such as diffraction grating structures, for example. FIG. 1a illustrates various crystal axes of a portion of a (110) substrate100. In one embodiment, the portion of the substrate 100 may comprise aportion of (110) silicon substrate 100. In other embodiments, the (110)substrate 100 may comprise a portion of a (110) single crystal siliconwafer substrate 100, for example. In an embodiment, a [110] direction115 of the (110) silicon substrate 100 may be perpendicular to the planeof the (110) substrate 100, and may be in an upward direction relativeto the plane of the (110) substrate 100 in an embodiment. The (110)substrate 100 may comprise four symmetrical crystallographic planes{111}, and may include a (−11-1) plane 101, a (1-1-1) plane 103, a(−111) plane 105, and a (1-11) plane 107. These crystallographic planesmay intersect each other at an angle of either 70.6 degrees 111 or 109.4degrees 109.

In an embodiment, the (110) substrate 100 may be used to fabricate anon-chip DG, wherein the grooves of the DG may be formed by etching thegrooves into the substrate itself, by using a wet etchant, for example.In an embodiment, a crystallographic etchant may be applied to the (110)substrate 100. For example, wet etchants such as but not limited to KOH(potassium hydroxide), EDP (ethylene diamene pyrocatechol), TMAH(tetramethylammoniumhydroxide), or NH4OH (ammonium hydroxide) may beapplied to the (110) substrate 100.

Upon application of the wet etchant to the (110) substrate 100, the{111} planes of the (110) substrate 100 form an etch-stop because of thehigh atomic density in the <111> directions. In an embodiment, the wetetchant may perform an anisotropic etch, which may be slower in theplanes of the {111} silicon substrate 100 and create vertical sidewalls.In an embodiment, by utilizing an appropriately designed photomaskpattern, such as by using a photomask comprising a periodic array ofparallelograms, a sawtooth grating structure with perfectly-smoothvertical sidewalls can be crystallographically wet-etched into thesubstrate 100. In an embodiment, a groove shaped diffraction grating maybe formed/etched into the substrate 100, which may comprise a plane DGin some cases, such as an Echelle grating structure for example.

In an embodiment, diffraction grating structures formed by the etchingprocess can be categorized into two cases: a grating structure 120 witha 70.6 degree angle 111 between arms (FIG. 1 b) and another gratingstructure 120′ with a 109.4 degree 109 angle between arms (FIG. 1 c). Inan embodiment, the blazed angles 111, 109 of the diffraction gratingstructures 120, 120′ can be controlled by adjusting the lengths of arms115, 115′ and 117, 117′ in FIGS. 1 b-1 c. In an embodiment, the angles111 and 109 of the gratings 120, 120′ may be between the arms 115, 117and 115′, 117′ respectively. In an embodiment, the arms 115, 115′and117, 117′ of the diffraction grating structures 120, 120′ may comprise asawtooth structure.

In an embodiment, the diffraction grating structures 120, 120′ depictedin FIGS. 1 b-1 c may be used as a reflection grating, wherein ametal/reflective coating may be formed on the vertical sidewalls of thesawteeth structures of the diffraction grating structures 120, 120′and/or an incident angle larger than the total-internal reflection anglecan be used with the diffraction gratings 120, 120′, wherein thetransmission loss of the diffraction grating structures 120, 120′ may besignificantly reduced.

The preparation of a photomask pattern is important for the formation ofthe diffraction grating structures 120, 120′ depicted in FIGS. 1 b-1 c.For example, the arm lengths 115, 115′ and 117, 117′ of FIGS. 1 a-1 bmay be adjusted by the design of the photomask, and thus the angles 111,109 of the diffraction grating structures 120, 120′ may be controlled.In an embodiment, a photomask 202 may be formed on a (110) substrate 200(similar to the substrate 100 of FIG. 1 a), wherein the photomask 202may comprise a periodic array of parallelograms 204 (FIG. 2 a).

In an embodiment, there may be a gap 206 between individualparallelograms of the parallelogram array 204 of the photomask 202. Inan embodiment, a timed etch process may be performed on the photomaskedsubstrate 200, utilizing a wet etch chemical, such as but not limited toone of the wet etch chemicals described previously herein to form adiffraction grating 220 (FIG. 2 b). The diffraction grating 220 maycomprise arm lengths 215, 217 and an angle 216 between the arms 215,217, wherein the arm lengths may be defined the photomask 202 design.

In an embodiment, the diffraction grating structure 220 may comprise afirst side 221 and a second side 222. In an embodiment, the second side222 of the etched diffraction grating structure 220 may be removed,using a dry-etch process for example, but a wet etch may be used inother cases (FIG. 2 c). In another embodiment, the first side 221 may beremoved from the diffraction grating structure 220. Removal of eitherthe first or second sides 221, 222 of the diffraction grating structure220 may be desired for applications wherein a light source may beincoming incident from the ambient air, such as when the diffractiongrating structure 220 may be utilized in free space optical systems.

The diffraction grating structure 220 may comprise two major advantages.First, the sidewalls 223 of the diffraction grating structure 220 may besubstantially perfectly 90° straight, and may comprise a sidewall angle221 of about 90 degrees in an embodiment with negligible surfaceroughness because of the crystallographic wet-etch (FIG. 2 d). Such anadvantage is especially significant for creating a large active area,such as when a very deep etch depth is required. Secondly, even in thecase when the sharpness of a sawtooth structure (adjacent arms with anangle between) on the photomask cannot be defined perfectly, theresultant etched corner will nevertheless be extremely sharp. Such anadvantage is especially significant when a high groove density is used,such as when the corner feature size is comparable to or smaller thanthe lithography resolution.

FIG. 2 e depicts a flow chart of an embodiment. At step 230, a photomask may be formed on a (110) silicon substrate, wherein the photo maskcomprises a periodic array of parallelograms. At step 240, a wet etchantmay be applied to the (110) silicon substrate, wherein the {111} planesact as an etch stop for the wet etchant. At step 250, a timed etch maybe performed with the wet etchant to form a diffraction gratingstructure directly into the (110) silicon substrate.

Prior art large area DGs are routinely fabricated by either mechanicallyburnishing the grooves onto a substrate, or by reactive ion-beam etchinga holographic pattern developed by two-beam interference, for example.When integrating with waveguide-based optoelectronics, diffractiongratings, such as Echelle gratings, for example, are commonly used andfabricated by standard photolithography along with dry-etch. Such priorart approaches will result in undesired properties such as roughsurface, slanted sidewalls and blunt corners, which may seriouslydegrade the diffraction grating device optical quality. Because thegrooves of the prior art diffraction grating/waveguides are prepared bydry-etch techniques, where rough surfaces, slanted sidewalls and bluntcorners typically occur, such prior art waveguides typically exhibithigher-than-expected insertion loss, especially for 10 micron to 30micron large-core waveguides.

Benefits of the diffraction grating structure 220 include enabling theformation of on chip-plane DGs, wherein the crystallographic wet-etchingof a (110) silicon wafer can define plane DGs with ultra high opticalquality. Wet-etching of the (110) silicon substrate enables thefabrication of a 90° straight sidewall for the plane DG of the variousembodiments herein. Thus the formation of plane DGs with straight andsmooth sidewalls are enabled. For example, Echelle gratings for use incoarse-wave length division multiplexing (CWDM) applications may beformed according to the various embodiments included herein. Because thegrooves are prepared by wet-etch techniques, DGs of the variousembodiments exhibit lower insertion loss, especially for 10 micron to 30micron large-core waveguides, thus enabling the fabrication of idealEchelle gratings. Such grating structures will largely increase thetotal link budget, since a major loss of silicon photonics link comesfrom multiplexer and demultiplexer components.

In an embodiment, on-chip collimators may be incorporated with the DGsof the various embodiments to perform wavelength selection in plane DGbased multiplexer/demultiplexer devices. For example, a Czerny-Turnerconfiguration (2 collimators) or a Fastie-Ebert configuration (1collimator) may be employed, as shown in FIG. 3 showing ray trajectories304. FIG. 3 depicts a Czerny-Turner configuration 301, comprising a DG302 fabricated according to the embodiments herein and two collimators303. A Fastie-Ebert configuration 301′ comprising a DG 302 fabricatedaccording to the embodiments herein is depicted with a single collimator303′. A Fastie-Ebert configuration comprising a DG 302 fabricatedaccording to the embodiments herein is depicted with a single collimator303′ with a Littrow setting 301″.

In an embodiment, DG structures of the various embodiments herein may beformed on a silicon wafer 400 as illustrated in FIG. 4 a, and maycomprise portions of individual integrated circuits on dies 402. Thesilicon wafer 400 may be cut to separate the individual dies 402 fromeach other, as is known in the art. The individual dies 402 comprisingthe DG structure, such as the DG structures of FIGS. 1 b, 1 c and 2 c,for example, may then become part of a microelectronic package assembly408 (FIG. 4 b). The package assembly 408 may comprise a die 402 placedon a package substrate 406 with solder balls 404, in some embodiments,but may comprise any type of package according to the particularapplication.

FIG. 5 depicts a system according to an embodiment. System 500 includesa light source 510, such as a laser, for example, that may direct aninput optical beam into an optical diffraction grating structure 520,such as the diffraction grating structures of FIGS. 1 b, 1 c and 2 c,for example. The optical grating structures 520 may be communicativelycoupled to a receiver 530 that may comprise an optical receiver 530. Thereceiver 530 may be coupled to a processor 550, which may be coupled toa memory device 540, an input and output (I/O) controller 560, all ofwhich may be communicatively coupled to each other through a bus 570, insome embodiments. Processor 550 may be a general purpose processor or anapplication specific integrated circuit (ASIC). I/O controller 560 mayinclude a communication module for wired or wireless communication.Memory device 540 may be a dynamic random access memory (DRAM) device, astatic random access memory (SRAM) device, a flash memory device, or acombination of these memory devices. Thus, in some embodiments, memorydevice 540 in system 500 does not have to include a DRAM device.

One or more of the components shown in system 500 may include one ormore diffraction gratings of the various embodiments included herein.For example, processor 550, or memory device 540, or at least a portionof I/O controller 560, or a combination of these components may includein an integrated circuit package that includes at least one embodimentof the structures herein.

These elements perform their conventional functions well known in theart. In particular, memory device 540 may be used in some cases toprovide long-term storage for the executable instructions for a methodfor forming structures in accordance with some embodiments, and in otherembodiments may be used to store on a shorter term basis the executableinstructions of a method for forming structures in accordance withembodiments during execution by processor 550. In addition, theinstructions may be stored, or otherwise associated with, machineaccessible mediums communicatively coupled with the system, such ascompact disk read only memories (CD-ROMs), digital versatile disks(DVDs), and floppy disks, carrier waves, and/or other propagatedsignals, for example. In one embodiment, memory device 540 may supplythe processor 550 with the executable instructions for execution.

System 500 may include computers (e.g., desktops, laptops, hand-helds,servers, Web appliances, routers, etc.), wireless communication devices(e.g., cellular phones, cordless phones, pagers, personal digitalassistants, etc.), computer-related peripherals (e.g., printers,scanners, monitors, etc.), entertainment devices (e.g., televisions,radios, stereos, tape and compact disc players, video cassetterecorders, camcorders, digital cameras, MP3 (Motion Picture ExpertsGroup, Audio Layer 3) players, video games, watches, etc.), and thelike.

Although the foregoing description has specified certain steps andmaterials that may be used in the embodiments, those skilled in the artwill appreciate that many modifications and substitutions may be made.Accordingly, it is intended that all such modifications, alterations,substitutions and additions be considered to fall within the spirit andscope of the embodiments as defined by the appended claims. The Figuresprovided herein illustrate only portions of exemplary microelectronicstructures that pertain to the practice of the embodiments. Thus theembodiments are not limited to the structures described herein.

1. A method comprising: applying a wet etchant to a (110) silicon substrate, wherein the (110) silicon substrate comprises a photo mask comprising a periodic array of parallelograms; and forming a diffraction grating structure into the (110) silicon substrate, wherein the {111} planes of the (110) silicon substrate form an etch stop during the etching of the (110) silicon substrate.
 2. The method of claim 1 further comprising wherein the diffraction grating structure comprises smooth, vertical sidewalls, wherein the sidewalls are substantially 90 degree sidewalls.
 3. The method of claim 1 further comprising wherein forming the diffraction grating structure further comprises forming an angle between arms of the diffraction grating structure.
 4. The method of claim 3 further comprising wherein the angle between the arms of the diffraction grating structure comprises one of about a 70.6 degree angle and about a 109.4 degree angle.
 5. The method of claim 1 further comprising wherein the diffraction grating structure comprises an Echelle diffraction grating structure.
 6. The method of claim 1 further comprising wherein the diffraction grating structure comprises a portion of a coarse-wave length division multiplexing (CWDM) optical system.
 7. The method of claim 1 further comprising wherein the diffraction grating comprises a 10 to a 30 micron large core waveguide.
 8. The method of claim 6 further comprising wherein the CWDM optical system further comprises on-chip collimators.
 9. The method of claim 1 further comprising wherein the wet etchant comprises one of KOH, TMAH, and NH4OH.
 10. The method of claim 1 further comprising wherein the wet etchant performs a crystallographic anisotropic etch on the (110) silicon substrate.
 11. A method of forming a diffraction grating comprising: forming a photomask on a (110) silicon wafer substrate, wherein the photomask comprises a periodic array of parallelogram openings; performing a timed wet etch on the (110) silicon wafer substrate to form a diffraction grating structure that is etched into the (110) silicon wafer substrate.
 12. The method of claim 11 further comprising wherein corners of adjacent parallelogram openings are not contiguous.
 13. The method of claim 11 further comprising wherein a side of the diffraction grating structure is removed, wherein a light source may be applied incident from the ambient air to the diffraction grating structure.
 14. The method of claim 11 further comprising wherein a sidewall of the diffraction grating may comprise a reflective coating.
 15. A structure comprising: a diffraction grating structure etched into a (110) silicon substrate, wherein an angle between adjacent arms of the diffraction grating structure comprise an angle of one of 70.6 degrees and 109.4 degrees.
 16. The structure of claim 15 wherein the diffraction grating structure comprises smooth, substantially vertical sidewalls.
 17. The structure of claim 16 wherein the sidewalls are substantially 90 degree sidewalls.
 18. The structure of claim 15 wherein the diffraction grating structure comprises an Echelle diffraction grating structure.
 19. The structure of claim 15 wherein a light source may be applied incident from the ambient air to the diffraction grating structure.
 20. A structure comprising: a portion of a die comprising a (110) silicon substrate; and a diffraction grating structure etched into the (110) silicon substrate.
 21. The structure of claim 20 wherein the diffraction grating structure comprises an angle of one of 70.6 degrees and 109.4 degrees between adjacent arms of the diffraction grating structure.
 22. The structure of claim 20 wherein the diffraction grating comprises substantially smooth sidewalls.
 23. The structure of claim 20 wherein a sidewall angle of the diffraction grating structure comprises about a 90 degree angle.
 24. A device comprising: a portion of a die comprising a (110) silicon substrate; a diffraction grating structure etched into the (110) silicon substrate; and a package substrate, wherein the portion of the die is disposed on the package substrate.
 25. The device of claim 24 wherein an angle between arms of the diffraction grating structure comprise one of about a 70.6 degrees and about a 109.4 degrees.
 26. The device of claim 24 wherein the diffraction grating structure comprises an Echelle diffraction grating structure.
 27. The device of claim 24 wherein the diffraction grating structure comprises a portion of a coarse-wave length division multiplexing (CWDM) optical system.
 28. The device of claim 24 further comprising wherein the diffraction grating comprises a 10 to a 30 micron large core waveguide.
 29. The device of claim 27 wherein the CWDM optical system further comprises on-chip collimators.
 30. The device of claim 24 further comprising a system, wherein the device is coupled to an optical receiver. 